HPL coating post-forming adhesive based on polychloroprene with very high adhesive strength and high heat resistance, is ready to use and does not need to be diluted.
In particular, it is used for gluing HPL (High Pressure Laminate) coatings to MDF and chipboard panels, but the most common use of this glue is in post-forming applications that apply HPL coatings on the curved edges of MDF and chipboard panels. sticks
Color
Yellow to light brown
concentration (viscosity)
300-500 (centipoise)
Application temperature
Above 10 degrees Celsius
Pressure required to stick
0.2-2 bar
Adhesive storage conditions
Temperature 5 to 35 degrees Celsius
Aleppo 13.9 kg