HPL coating post-forming adhesive based on polychloroprene with very high adhesive strength and high heat resistance, is ready to use and does not need to be diluted.
In particular, it is used for gluing HPL (High Pressure Laminate) coatings to MDF and chipboard panels, but the most common use of this glue is in post-forming applications that apply HPL coatings on the curved edges of MDF and chipboard panels. sticks
Color

Yellow to light brown

concentration (viscosity)

300-500 (centipoise)

Application temperature

Above 10 degrees Celsius

Pressure required to stick

0.2-2 bar

Adhesive storage conditions

Temperature 5 to 35 degrees Celsius

Aleppo 13.9 kg